Calibre 3DSTACK: Bringing a 3rd Dimension to IC Verification

 

Overview

 

Join our introductory webinar, as we explore how Calibre 3DSTACK provides a fast and accurate way to perform die alignment and connectivity checking for 2.5D & 3D IC Designs.

 

 

 

 

The Calibre 3DSTACK tool extends Calibre die-level signoff verification to complete signoff verification of a wide range of 2.5D and 3D stacked die designs. Designers can run signoff DRC and LVS checking of complete multi-die systems at any process node using existing tool flows and data formats.

 

This 1-hour webinar is your chance to gain valuable insights into how to use 3DSTACK for your full stack verification when working with advanced packaging and multi-die package manufacturability. It is also an opportunity to have your questions answered by our experts.

 

What You Will Learn:

• An overview of 3D IC Technology
• 3DSTACK's capabilities, flows and the benefits it offers
• Expert insights into configuration and rule deck utilization
• Assembly layout generation processes
   

Who Should Attend?

• Designers and CAD engineers specialized in design, verification & manufacturing processes. Everyone interested in the practical application of Calibre 3DSTACK and multi-die verification

 
Products Featured:

• Calibre 3DSTACK

 

Details

 

What

Customer Technical Webcast: Calibre 3DSTACK: Bringing a 3rd Dimension to IC Verification

 

When

Wednesday, November 29, 2023

 

Where
Online

 

Time
18:00 hr CET